CPU-Z 
  
Binaries 
CPU-Z version2.15.0.x64
  
Processors 
CPU Groups1
CPU Group 024 threads, mask=0xFFFFFF
  
Number of sockets1
Number of threads24
  
APICs 
Socket 0
     -- Node 0
         -- CCD 0
         -- CCX 0
         -- Core 0 (ID 0)
         -- Thread 00
         -- Thread 11
         -- Core 1 (ID 1)
         -- Thread 22
         -- Thread 33
         -- Core 2 (ID 2)
         -- Thread 44
         -- Thread 55
         -- Core 3 (ID 3)
         -- Thread 66
         -- Thread 77
         -- Core 4 (ID 4)
         -- Thread 88
         -- Thread 99
         -- Core 5 (ID 5)
         -- Thread 1010
         -- Thread 1111
         -- CCD 1
         -- CCX 0
         -- Core 6 (ID 8)
         -- Thread 1216
         -- Thread 1317
         -- Core 7 (ID 9)
         -- Thread 1418
         -- Thread 1519
         -- Core 8 (ID 10)
         -- Thread 1620
         -- Thread 1721
         -- Core 9 (ID 11)
         -- Thread 1822
         -- Thread 1923
         -- Core 10 (ID 12)
         -- Thread 2024
         -- Thread 2125
         -- Core 11 (ID 13)
         -- Thread 2226
         -- Thread 2327
  
Timers 
     ACPI timer3.580 MHz
     Perf timer10.000 MHz
     Sys timer1.000 KHz
  
  
Processors Information 
Socket 1ID = 0
     Number of cores12 (max 12)
     Number of threads24 (max 24)
     Secondary bus #0
     Number of CCDs2
     ManufacturerAuthenticAMD
     NameAMD Ryzen 9 5900X
     CodenameVermeer
     SpecificationAMD Ryzen 9 5900X 12-Core Processor
     Package Socket AM4 (1331)
     CPUIDF.1.2
     Extended CPUID19.21
     Core SteppingVMR-B2
     Technology7 nm
     TDP Limit105.0 Watts
     Tjmax90.0 �C
     Core Speed4813.3 MHz
     Multiplier x Bus Speed48.25 x 99.8 MHz
     Base frequency (cores)99.8 MHz
     Instructions setsMMX (+), SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, x86-64, AMD-V, AES, AVX, AVX2, FMA3, SHA
     Microcode Revision0xA201205
     L1 Data cache12 x 32 KB (8-way, 64-byte line)
     L1 Instruction cache12 x 32 KB (8-way, 64-byte line)
     L2 cache12 x 512 KB (8-way, 64-byte line)
     L3 cache2 x 32 MB (16-way, 64-byte line)
     Max CPUID level00000010h
     Max CPUID ext. level80000023h
     FID/VID Controlyes
     # of P-States3
     P-StateFID 0x894 - VID 0x48 (37.00x - 1.100 V)
     P-StateFID 0xA8C - VID 0x58 (28.00x - 1.000 V)
     P-StateFID 0xC84 - VID 0x68 (22.00x - 0.900 V)
  
     PStateReg0x80000000-0x49520894
     PStateReg0x80000000-0x47160A8C
     PStateReg0x80000000-0x459A0C84
     PStateReg0x00000000-0x00000000
     PStateReg0x00000000-0x00000000
     PStateReg0x00000000-0x00000000
     PStateReg0x00000000-0x00000000
     PStateReg0x00000000-0x00000000
  
     Package Type0x2
     Model00
     String 10x0
     String 20x0
     Page0x0
     Power Unit0.0
     SMU Version56.69.00
     TDP/TJMAX0x69005A
     TCTL Offset0x0
     PMTV00380805
     Min Frequency550 MHz
     Max Frequency4950 MHz
     VID Limit1.5000 Volts
     PBO Scalar1
     Package Power Tracking (PPT)Current : 142.0 W, fused : 142.0 W
     Thermal Design Current (TDC)Current : 95.0 A, fused : 95.0 A
     Electrical Design Current (EDC)Current : 140.0 A, fused : 140.0 A
  
     Temperature 055 degC (131 degF) (Package)
     Temperature 159 degC (137 degF) (CCD #0)
     Temperature 255 degC (130 degF) (CCD #1)
     Temperature 350 degC (121 degF) (Cores (Max))
     Temperature 448 degC (118 degF) (Core #0)
     Temperature 550 degC (121 degF) (Core #1)
     Temperature 646 degC (115 degF) (Core #2)
     Temperature 748 degC (118 degF) (Core #3)
     Temperature 845 degC (113 degF) (Core #4)
     Temperature 945 degC (113 degF) (Core #5)
     Temperature 1045 degC (112 degF) (Core #6)
     Temperature 1144 degC (110 degF) (Core #7)
     Temperature 1243 degC (110 degF) (Core #8)
     Temperature 1343 degC (108 degF) (Core #9)
     Temperature 1443 degC (109 degF) (Core #10)
     Temperature 1545 degC (112 degF) (Core #11)
     Temperature 1646 degC (115 degF) (L3 Cache #0)
     Temperature 1743 degC (110 degF) (L3 Cache #1)
     Temperature 1841 degC (106 degF) (SoC)
     Voltage 01.43 Volts (VID)
     Voltage 11.42 Volts (CPU VDD)
     Voltage 20.97 Volts (SoC VDD)
     Power 0042.97 W (Package)
     Power 017.15 W (Cores)
     Power 020.18 W (Core #0)
     Power 031.56 W (Core #1)
     Power 040.25 W (Core #2)
     Power 051.52 W (Core #3)
     Power 060.40 W (Core #4)
     Power 070.23 W (Core #5)
     Power 080.22 W (Core #6)
     Power 091.07 W (Core #7)
     Power 100.14 W (Core #8)
     Power 110.21 W (Core #9)
     Power 120.17 W (Core #10)
     Power 131.19 W (Core #11)
     Power 142.58 W (L3 Cache #0)
     Power 151.57 W (L3 Cache #1)
     Power 16142.00 W (PPT Limit)
     Clock Speed 04813.30 MHz (Core #0)
     Clock Speed 13666.09 MHz (Core #1)
     Clock Speed 24663.67 MHz (Core #2)
     Clock Speed 33666.09 MHz (Core #3)
     Clock Speed 43730.93 MHz (Core #4)
     Clock Speed 53850.64 MHz (Core #5)
     Clock Speed 63666.09 MHz (Core #6)
     Clock Speed 73666.09 MHz (Core #7)
     Clock Speed 83666.09 MHz (Core #8)
     Clock Speed 93666.09 MHz (Core #9)
     Clock Speed 103691.03 MHz (Core #10)
     Clock Speed 113666.09 MHz (Core #11)
     Clock Speed 1299.76 MHz (CPU BCLK)
     Clock Speed 13n.a. (SOC BCLK)
     Clock Speed 143665.46 MHz (L3 Cache #0)
     Clock Speed 153665.46 MHz (L3 Cache #1)
     Core 0 max ratio(effective) 48.75
     Core 1 max ratio(effective) 46.50
     Core 2 max ratio(effective) 48.00
     Core 3 max ratio(effective) 37.00
     Core 4 max ratio(effective) 47.75
     Core 5 max ratio(effective) 47.25
     Core 6 max ratio(effective) 46.50
     Core 7 max ratio(effective) 47.00
     Core 8 max ratio(effective) 46.50
     Core 9 max ratio(effective) 47.00
     Core 10 max ratio(effective) 46.25
     Core 11 max ratio(effective) 46.50
  
  
  
Chipset 
NorthbridgeAMD Ryzen SOC rev. 00
SouthbridgeAMD B550 rev. 51
Bus SpecificationPCI-Express 4.0 (16.0 GT/s)
Graphic InterfacePCI-Express 4.0
PCI-E Link Widthx16 (max 16x)
PCI-E Link Speed2.5 GT/s (max 16.0 GT/s)
Memory TypeDDR4
Memory Size32 GBytes
Channels2 x 64-bit
Memory Frequency1063.6 MHz (3:32)
Memory Max Frequency1600.0 MHz
CAS# latency (CL)15.0
RAS# to CAS# delay (tRCD)15
RAS# Precharge (tRP)15
Cycle Time (tRAS)36
Bank Cycle Time (tRC)51
Command Rate (CR)2T
Uncore Frequency1064.1 MHz
  
Memory SPD 
DIMM #1
     SMBus address0x50
     Memory typeDDR4
     Module formatUDIMM
     Module Manufacturer(ID)Corsair (7F7F9E00000000000000000000000000)
     SDRAM Manufacturer (ID)Micron Technology (2C000000000000000000000000000000)
     Size8192 MBytes
     Max bandwidthDDR4-3200 (1600 MHz)
     Max JEDECDDR4-2133 (1066 MHz)
     Part numberCMH32GX4M4E3200C16
     Nominal Voltage1.20 Volts
     EPPno
     XMPyes, rev. 2.0
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #17.0-8-8-18-25 @ 533 MHz
     JEDEC #28.0-9-9-20-28 @ 600 MHz
     JEDEC #39.0-9-9-22-31 @ 666 MHz
     JEDEC #410.0-10-10-25-35 @ 733 MHz
     JEDEC #511.0-11-11-27-38 @ 800 MHz
     JEDEC #612.0-13-13-30-42 @ 900 MHz
     JEDEC #713.0-14-14-32-45 @ 966 MHz
     JEDEC #814.0-14-14-35-49 @ 1033 MHz
     JEDEC #915.0-15-15-36-50 @ 1066 MHz
     JEDEC #1016.0-15-15-36-50 @ 1066 MHz
     JEDEC #1117.0-15-15-36-50 @ 1066 MHz
     JEDEC #1218.0-15-15-36-50 @ 1066 MHz
     JEDEC #1319.0-15-15-36-50 @ 1066 MHz
     JEDEC #1420.0-15-15-36-50 @ 1066 MHz
     JEDEC #1521.0-15-15-36-50 @ 1066 MHz
     JEDEC #1622.0-15-15-36-50 @ 1066 MHz
     JEDEC #1723.0-15-15-36-50 @ 1066 MHz
     JEDEC #1824.0-15-15-36-50 @ 1066 MHz
XMP profileXMP-3200
     SpecificationDDR4-3200
     VDD Voltage1.350 Volts
     Min Cycle time0.625 ns (1600 MHz)
     Max CL16.0
     Min tRP12.49 ns
     Min tRCD12.49 ns
     Min tRAS23.61 ns
     Min tRC36.24 ns
     Min tRRD3.75 ns
XMP timings tableCL-tRCD-tRP-tRAS-tRC-CR @ frequency (voltage)
     XMP #17.0-9-9-17-26-n.a @ 700 MHz (1.350 Volts)
     XMP #28.0-11-11-19-30-n.a @ 800 MHz (1.350 Volts)
     XMP #39.0-12-12-22-33-n.a @ 900 MHz (1.350 Volts)
     XMP #410.0-13-13-24-37-n.a @ 1001 MHz (1.350 Volts)
     XMP #511.0-14-14-27-40-n.a @ 1101 MHz (1.350 Volts)
     XMP #612.0-16-16-29-44-n.a @ 1201 MHz (1.350 Volts)
     XMP #713.0-17-17-31-48-n.a @ 1301 MHz (1.350 Volts)
     XMP #814.0-18-18-34-51-n.a @ 1401 MHz (1.350 Volts)
     XMP #915.0-19-19-36-55-n.a @ 1501 MHz (1.350 Volts)
     XMP #1016.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1117.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1218.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1319.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1420.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1521.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1622.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1723.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1824.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
  
DIMM #2
     SMBus address0x51
     Memory typeDDR4
     Module formatUDIMM
     Module Manufacturer(ID)Corsair (7F7F9E00000000000000000000000000)
     SDRAM Manufacturer (ID)Micron Technology (2C000000000000000000000000000000)
     Size8192 MBytes
     Max bandwidthDDR4-3200 (1600 MHz)
     Max JEDECDDR4-2133 (1066 MHz)
     Part numberCMH32GX4M4E3200C16
     Nominal Voltage1.20 Volts
     EPPno
     XMPyes, rev. 2.0
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #17.0-8-8-18-25 @ 533 MHz
     JEDEC #28.0-9-9-20-28 @ 600 MHz
     JEDEC #39.0-9-9-22-31 @ 666 MHz
     JEDEC #410.0-10-10-25-35 @ 733 MHz
     JEDEC #511.0-11-11-27-38 @ 800 MHz
     JEDEC #612.0-13-13-30-42 @ 900 MHz
     JEDEC #713.0-14-14-32-45 @ 966 MHz
     JEDEC #814.0-14-14-35-49 @ 1033 MHz
     JEDEC #915.0-15-15-36-50 @ 1066 MHz
     JEDEC #1016.0-15-15-36-50 @ 1066 MHz
     JEDEC #1117.0-15-15-36-50 @ 1066 MHz
     JEDEC #1218.0-15-15-36-50 @ 1066 MHz
     JEDEC #1319.0-15-15-36-50 @ 1066 MHz
     JEDEC #1420.0-15-15-36-50 @ 1066 MHz
     JEDEC #1521.0-15-15-36-50 @ 1066 MHz
     JEDEC #1622.0-15-15-36-50 @ 1066 MHz
     JEDEC #1723.0-15-15-36-50 @ 1066 MHz
     JEDEC #1824.0-15-15-36-50 @ 1066 MHz
XMP profileXMP-3200
     SpecificationDDR4-3200
     VDD Voltage1.350 Volts
     Min Cycle time0.625 ns (1600 MHz)
     Max CL16.0
     Min tRP12.49 ns
     Min tRCD12.49 ns
     Min tRAS23.61 ns
     Min tRC36.24 ns
     Min tRRD3.75 ns
XMP timings tableCL-tRCD-tRP-tRAS-tRC-CR @ frequency (voltage)
     XMP #17.0-9-9-17-26-n.a @ 700 MHz (1.350 Volts)
     XMP #28.0-11-11-19-30-n.a @ 800 MHz (1.350 Volts)
     XMP #39.0-12-12-22-33-n.a @ 900 MHz (1.350 Volts)
     XMP #410.0-13-13-24-37-n.a @ 1001 MHz (1.350 Volts)
     XMP #511.0-14-14-27-40-n.a @ 1101 MHz (1.350 Volts)
     XMP #612.0-16-16-29-44-n.a @ 1201 MHz (1.350 Volts)
     XMP #713.0-17-17-31-48-n.a @ 1301 MHz (1.350 Volts)
     XMP #814.0-18-18-34-51-n.a @ 1401 MHz (1.350 Volts)
     XMP #915.0-19-19-36-55-n.a @ 1501 MHz (1.350 Volts)
     XMP #1016.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1117.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1218.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1319.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1420.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1521.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1622.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1723.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1824.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
  
DIMM #3
     SMBus address0x52
     Memory typeDDR4
     Module formatUDIMM
     Module Manufacturer(ID)Corsair (7F7F9E00000000000000000000000000)
     SDRAM Manufacturer (ID)Micron Technology (2C000000000000000000000000000000)
     Size8192 MBytes
     Max bandwidthDDR4-3200 (1600 MHz)
     Max JEDECDDR4-2133 (1066 MHz)
     Part numberCMH32GX4M4E3200C16
     Nominal Voltage1.20 Volts
     EPPno
     XMPyes, rev. 2.0
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #17.0-8-8-18-25 @ 533 MHz
     JEDEC #28.0-9-9-20-28 @ 600 MHz
     JEDEC #39.0-9-9-22-31 @ 666 MHz
     JEDEC #410.0-10-10-25-35 @ 733 MHz
     JEDEC #511.0-11-11-27-38 @ 800 MHz
     JEDEC #612.0-13-13-30-42 @ 900 MHz
     JEDEC #713.0-14-14-32-45 @ 966 MHz
     JEDEC #814.0-14-14-35-49 @ 1033 MHz
     JEDEC #915.0-15-15-36-50 @ 1066 MHz
     JEDEC #1016.0-15-15-36-50 @ 1066 MHz
     JEDEC #1117.0-15-15-36-50 @ 1066 MHz
     JEDEC #1218.0-15-15-36-50 @ 1066 MHz
     JEDEC #1319.0-15-15-36-50 @ 1066 MHz
     JEDEC #1420.0-15-15-36-50 @ 1066 MHz
     JEDEC #1521.0-15-15-36-50 @ 1066 MHz
     JEDEC #1622.0-15-15-36-50 @ 1066 MHz
     JEDEC #1723.0-15-15-36-50 @ 1066 MHz
     JEDEC #1824.0-15-15-36-50 @ 1066 MHz
XMP profileXMP-3200
     SpecificationDDR4-3200
     VDD Voltage1.350 Volts
     Min Cycle time0.625 ns (1600 MHz)
     Max CL16.0
     Min tRP12.49 ns
     Min tRCD12.49 ns
     Min tRAS23.61 ns
     Min tRC36.24 ns
     Min tRRD3.75 ns
XMP timings tableCL-tRCD-tRP-tRAS-tRC-CR @ frequency (voltage)
     XMP #17.0-9-9-17-26-n.a @ 700 MHz (1.350 Volts)
     XMP #28.0-11-11-19-30-n.a @ 800 MHz (1.350 Volts)
     XMP #39.0-12-12-22-33-n.a @ 900 MHz (1.350 Volts)
     XMP #410.0-13-13-24-37-n.a @ 1001 MHz (1.350 Volts)
     XMP #511.0-14-14-27-40-n.a @ 1101 MHz (1.350 Volts)
     XMP #612.0-16-16-29-44-n.a @ 1201 MHz (1.350 Volts)
     XMP #713.0-17-17-31-48-n.a @ 1301 MHz (1.350 Volts)
     XMP #814.0-18-18-34-51-n.a @ 1401 MHz (1.350 Volts)
     XMP #915.0-19-19-36-55-n.a @ 1501 MHz (1.350 Volts)
     XMP #1016.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1117.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1218.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1319.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1420.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1521.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1622.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1723.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1824.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
  
DIMM #4
     SMBus address0x53
     Memory typeDDR4
     Module formatUDIMM
     Module Manufacturer(ID)Corsair (7F7F9E00000000000000000000000000)
     SDRAM Manufacturer (ID)Micron Technology (2C000000000000000000000000000000)
     Size8192 MBytes
     Max bandwidthDDR4-3200 (1600 MHz)
     Max JEDECDDR4-2133 (1066 MHz)
     Part numberCMH32GX4M4E3200C16
     Nominal Voltage1.20 Volts
     Temperature Limit0.0 degC (high limit), 0.0 degC (critical limit)
     EPPno
     XMPyes, rev. 2.0
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #17.0-8-8-18-25 @ 533 MHz
     JEDEC #28.0-9-9-20-28 @ 600 MHz
     JEDEC #39.0-9-9-22-31 @ 666 MHz
     JEDEC #410.0-10-10-25-35 @ 733 MHz
     JEDEC #511.0-11-11-27-38 @ 800 MHz
     JEDEC #612.0-13-13-30-42 @ 900 MHz
     JEDEC #713.0-14-14-32-45 @ 966 MHz
     JEDEC #814.0-14-14-35-49 @ 1033 MHz
     JEDEC #915.0-15-15-36-50 @ 1066 MHz
     JEDEC #1016.0-15-15-36-50 @ 1066 MHz
     JEDEC #1117.0-15-15-36-50 @ 1066 MHz
     JEDEC #1218.0-15-15-36-50 @ 1066 MHz
     JEDEC #1319.0-15-15-36-50 @ 1066 MHz
     JEDEC #1420.0-15-15-36-50 @ 1066 MHz
     JEDEC #1521.0-15-15-36-50 @ 1066 MHz
     JEDEC #1622.0-15-15-36-50 @ 1066 MHz
     JEDEC #1723.0-15-15-36-50 @ 1066 MHz
     JEDEC #1824.0-15-15-36-50 @ 1066 MHz
XMP profileXMP-3200
     SpecificationDDR4-3200
     VDD Voltage1.350 Volts
     Min Cycle time0.625 ns (1600 MHz)
     Max CL16.0
     Min tRP12.49 ns
     Min tRCD12.49 ns
     Min tRAS23.61 ns
     Min tRC36.24 ns
     Min tRRD3.75 ns
XMP timings tableCL-tRCD-tRP-tRAS-tRC-CR @ frequency (voltage)
     XMP #17.0-9-9-17-26-n.a @ 700 MHz (1.350 Volts)
     XMP #28.0-11-11-19-30-n.a @ 800 MHz (1.350 Volts)
     XMP #39.0-12-12-22-33-n.a @ 900 MHz (1.350 Volts)
     XMP #410.0-13-13-24-37-n.a @ 1001 MHz (1.350 Volts)
     XMP #511.0-14-14-27-40-n.a @ 1101 MHz (1.350 Volts)
     XMP #612.0-16-16-29-44-n.a @ 1201 MHz (1.350 Volts)
     XMP #713.0-17-17-31-48-n.a @ 1301 MHz (1.350 Volts)
     XMP #814.0-18-18-34-51-n.a @ 1401 MHz (1.350 Volts)
     XMP #915.0-19-19-36-55-n.a @ 1501 MHz (1.350 Volts)
     XMP #1016.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1117.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1218.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1319.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1420.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1521.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1622.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1723.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
     XMP #1824.0-20-20-38-58-n.a @ 1600 MHz (1.350 Volts)
  
  
Monitoring 
Mainboard ModelB550 Steel Legend (0x00000568 - 0xF32A3740)
  
LPCIO 
LPCIO VendorNuvoton
LPCIO ModelNCT6796D-E
LPCIO Vendor ID0x5CA3
LPCIO Chip ID0xD4
LPCIO Revision ID0x2A
  
Hardware Monitors 
Hardware monitorNuvoton NCT6796
     Voltage 80.99 Volts [0x3E] (CPU VCORE)
     Voltage 90.92 Volts [0x73] (VDDP)
     Voltage 1012.14 Volts [0xE6] (+12V)
     Voltage 115.02 Volts [0xD1] (+5V)
     Voltage 121.20 Volts [0x96] (DRAM)
     Voltage 131.09 Volts [0x88] (PREM_VDDCR_SOC)
     Voltage 153.31 Volts [0xCF] (+3.3V)
     Temperature 038 degC (100 degF) [0x26] (Southbridge)
     Temperature 141 degC (105 degF) [0x52] (Mainboard)
     Temperature 754 degC (129 degF) [0x36] (CPU)
     Fan 11196 RPM [0x4AC] (CPU)
  
Hardware monitorDIMM
     Temperature 041 degC (104 degF) [0xC288] (Core)
  
Hardware monitorDIMM
     Temperature 041 degC (106 degF) [0xC294] (Core)
  
Hardware monitorDIMM
     Temperature 041 degC (106 degF) [0xC294] (Core)
  
Hardware monitorDIMM
     Temperature 041 degC (105 degF) [0xC28C] (Core)
  
Hardware monitorAMD Ryzen Power Management
     Power 002.58 W [0x2] (L3 Cache #0)
     Power 011.57 W [0x1] (L3 Cache #1)
     Power 00142.00 W [0x8E] (PPT Limit)
     Temperature 048 degC (118 degF) [0x30] (Core #0)
     Temperature 050 degC (121 degF) [0x31] (Core #1)
     Temperature 046 degC (115 degF) [0x2E] (Core #2)
     Temperature 048 degC (118 degF) [0x30] (Core #3)
     Temperature 045 degC (113 degF) [0x2D] (Core #4)
     Temperature 045 degC (113 degF) [0x2D] (Core #5)
     Temperature 045 degC (112 degF) [0x2C] (Core #6)
     Temperature 044 degC (110 degF) [0x2B] (Core #7)
     Temperature 043 degC (110 degF) [0x2B] (Core #8)
     Temperature 043 degC (108 degF) [0x2A] (Core #9)
     Temperature 043 degC (109 degF) [0x2A] (Core #10)
     Temperature 045 degC (112 degF) [0x2C] (Core #11)
     Temperature 046 degC (115 degF) [0x2E] (L3 Cache #0)
     Temperature 043 degC (110 degF) [0x2B] (L3 Cache #1)
     Temperature 041 degC (106 degF) [0x29] (SoC)
  
Hardware monitorNVIDIA NVML
     Power 0140.33 W (GPU)
     Clock Speed 0210.00 MHz [0xD2] (Graphics)
     Clock Speed 1405.00 MHz [0x195] (Memory)
     Clock Speed 2n.a. (Processor)
  
Hardware monitorNVIDIA NVAPI
     Power 0142.48 W (GPU)
     Clock Speed 0210.00 MHz [0xD2] (Graphics)
     Clock Speed 1405.00 MHz [0x195] (Memory)
     Clock Speed 2n.a. (Processor)
  
Hardware monitorD3D
  
Hardware monitorNVIDIA I/O
  
  
PCI Devices 
DescriptionHost Bridge
Locationbus 0 (0x00), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1480
     Revision ID0x00
PCI header
     Subvendor ID0x1022 (AMD)
     Subsystem ID0x1480
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 1 (0x01), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1482
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 1 (0x01), function 1 (0x01)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1483
     Revision ID0x00
PCI header
     Primary bus0x00
     Secondary bus0x01
     Int. Line0x00
     Int. Pin0x00
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x58
     Device typeRoot Port of PCI-E Root Complex
     Port1
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width4x (max 4x)
     Link speed8.0 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1022 (AMD)
     SubSystem ID0x1453
PCI capability
     Caps classHyperTransport
     Caps offset0xC8
     Interface typeMSI Mapping
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 1 (0x01), function 2 (0x02)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1483
     Revision ID0x00
PCI header
     Primary bus0x00
     Secondary bus0x02
     Int. Line0x00
     Int. Pin0x00
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x58
     Device typeRoot Port of PCI-E Root Complex
     Port0
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width4x (max 8x)
     Link speed8.0 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1022 (AMD)
     SubSystem ID0x1453
PCI capability
     Caps classHyperTransport
     Caps offset0xC8
     Interface typeMSI Mapping
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 2 (0x02), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1482
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 3 (0x03), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1482
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 3 (0x03), function 1 (0x01)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1483
     Revision ID0x00
PCI header
     Primary bus0x00
     Secondary bus0x06
     Int. Line0x00
     Int. Pin0x00
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x58
     Device typeRoot Port of PCI-E Root Complex
     Port0
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width16x (max 16x)
     Link speed2.5 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1022 (AMD)
     SubSystem ID0x1453
PCI capability
     Caps classHyperTransport
     Caps offset0xC8
     Interface typeMSI Mapping
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 4 (0x04), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1482
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 5 (0x05), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1482
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 7 (0x07), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1482
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 7 (0x07), function 1 (0x01)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1484
     Revision ID0x00
PCI header
     Primary bus0x00
     Secondary bus0x07
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x58
     Device typeRoot Port of PCI-E Root Complex
     Port0
     Caps version2.0
     Physical slotIntegrated device
     Link width16x (max 16x)
     Link speed16.0 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1022 (AMD)
     SubSystem ID0x1484
PCI capability
     Caps classHyperTransport
     Caps offset0xC8
     Interface typeMSI Mapping
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 8 (0x08), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1482
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 8 (0x08), function 1 (0x01)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1484
     Revision ID0x00
PCI header
     Primary bus0x00
     Secondary bus0x08
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x58
     Device typeRoot Port of PCI-E Root Complex
     Port0
     Caps version2.0
     Physical slotIntegrated device
     Link width16x (max 16x)
     Link speed16.0 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1022 (AMD)
     SubSystem ID0x1484
PCI capability
     Caps classHyperTransport
     Caps offset0xC8
     Interface typeMSI Mapping
  
DescriptionSMBus Controller
Locationbus 0 (0x00), device 20 (0x14), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x790B
     Revision ID0x61
PCI header
     Subvendor ID0x1849 (Asrock)
     Subsystem ID0xFFFF
     Int. Line0x00
     Int. Pin0x00
  
DescriptionPCI to ISA Bridge
Locationbus 0 (0x00), device 20 (0x14), function 3 (0x03)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x790E
     Revision ID0x51
PCI header
     Subvendor ID0x1849 (Asrock)
     Subsystem ID0xFFFF
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1440
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 1 (0x01)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1441
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 2 (0x02)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1442
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 3 (0x03)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1443
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 4 (0x04)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1444
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 5 (0x05)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1445
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 6 (0x06)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1446
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionHost Bridge
Locationbus 0 (0x00), device 24 (0x18), function 7 (0x07)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1447
     Revision ID0x00
PCI header
     Subvendor ID0x0000
     Subsystem ID0x0000
     Int. Line0x00
     Int. Pin0x00
  
DescriptionNVM Express (NVMe) Controller
Locationbus 1 (0x01), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x2646 (Kingston)
     Model ID0x500E
     Revision ID0x01
PCI header
     Address 0 (memory)0x00000000FC800004
     Subvendor ID0x2646 (Kingston)
     Subsystem ID0x500E
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classPCI Express
     Caps offset0x80
     Device typePCI-E Endpoint Device
     Port1
     Caps version2.0
     Link width4x (max 4x)
     Link speed8.0 GT/s (max 8.0 GT/s)
PCI capability
     Caps classMSI-X
     Caps offset0xD0
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xE0
PCI capability
     Caps classPower Management
     Caps offset0xF8
     Caps version1.2
  
DescriptionUSB Controller (xHCI)
Locationbus 2 (0x02), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x43EE
     Revision ID0x00
PCI header
     Address 0 (memory)0x00000000FC7A0004
     Subvendor ID0x1B21 (ASMedia)
     Subsystem ID0x1142
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classMSI-X
     Caps offset0x68
PCI capability
     Caps classPower Management
     Caps offset0x78
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x80
     Device typeLegacy PCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width4x (max 4x)
     Link speed8.0 GT/s (max 8.0 GT/s)
  
DescriptionSerial ATA Controller - AHCI
Locationbus 2 (0x02), device 0 (0x00), function 1 (0x01)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x43EB
     Revision ID0x00
PCI header
     Address 5 (memory)0xFC7E0000
     Subvendor ID0x1B21 (ASMedia)
     Subsystem ID0x1062
     Int. Line0x00
     Int. Pin0x02
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classPower Management
     Caps offset0x78
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x80
     Device typeLegacy PCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width4x (max 4x)
     Link speed8.0 GT/s (max 8.0 GT/s)
  
DescriptionPCI to PCI Bridge
Locationbus 2 (0x02), device 0 (0x00), function 2 (0x02)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x43E9
     Revision ID0x00
PCI header
     Primary bus0x02
     Secondary bus0x03
     Int. Line0xFF
     Int. Pin0x03
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classPower Management
     Caps offset0x78
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x80
     Device typeUpstream Port of PCI-E Switch
     Port0
     Caps version2.0
     Link width4x (max 4x)
     Link speed8.0 GT/s (max 8.0 GT/s)
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1B21 (ASMedia)
     SubSystem ID0x0201
  
DescriptionPCI to PCI Bridge
Locationbus 3 (0x03), device 4 (0x04), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x43EA
     Revision ID0x00
PCI header
     Primary bus0x03
     Secondary bus0x04
     Int. Line0xFF
     Int. Pin0x01
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classPower Management
     Caps offset0x78
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x80
     Device typeDownstream Port of PCI-E Switch
     Port4
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width2x (max 2x)
     Link speed8.0 GT/s (max 8.0 GT/s)
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1B21 (ASMedia)
     SubSystem ID0x3308
  
DescriptionPCI to PCI Bridge
Locationbus 3 (0x03), device 8 (0x08), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x43EA
     Revision ID0x00
PCI header
     Primary bus0x03
     Secondary bus0x05
     Int. Line0xFF
     Int. Pin0x01
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classPower Management
     Caps offset0x78
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x80
     Device typeDownstream Port of PCI-E Switch
     Port8
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width1x (max 1x)
     Link speed5.0 GT/s (max 8.0 GT/s)
PCI capability
     Caps classSubsystem Vendor
     Caps offset0xC0
     SubVendor ID0x1B21 (ASMedia)
     SubSystem ID0x3308
  
DescriptionNVM Express (NVMe) Controller
Locationbus 4 (0x04), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x2646 (Kingston)
     Model ID0x500E
     Revision ID0x01
PCI header
     Address 0 (memory)0x00000000FC600004
     Subvendor ID0x2646 (Kingston)
     Subsystem ID0x500E
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classPCI Express
     Caps offset0x80
     Device typePCI-E Endpoint Device
     Port1
     Caps version2.0
     Link width2x (max 4x)
     Link speed8.0 GT/s (max 8.0 GT/s)
PCI capability
     Caps classMSI-X
     Caps offset0xD0
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xE0
PCI capability
     Caps classPower Management
     Caps offset0xF8
     Caps version1.2
  
DescriptionEthernet Controller
Locationbus 5 (0x05), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x10EC (Realtek)
     Model ID0x8125
     Revision ID0x05
PCI header
     Address 0 (port)0x0000F000
     Address 2 (memory)0x00000000FC500004
     Address 4 (memory)0x00000000FC510004
     Subvendor ID0x1849 (Asrock)
     Subsystem ID0x8125
     Int. Line0x1C
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x40
     Caps version1.2
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classPCI Express
     Caps offset0x70
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width1x (max 1x)
     Link speed5.0 GT/s (max 5.0 GT/s)
PCI capability
     Caps classMSI-X
     Caps offset0xB0
PCI capability
     Caps classVirtual Product Data
     Caps offset0xD0
  
DescriptionVGA Controller
Locationbus 6 (0x06), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x10DE (NVIDIA)
     Model ID0x2204
     Revision ID0xA1
PCI header
     Address 0 (memory)0xFB000000
     Address 1 (memory)0x00000000D000000C
     Address 3 (memory)0x00000000E000000C
     Address 5 (port)0x0000E000
     Subvendor ID0x1458 (GIGABYTE)
     Subsystem ID0x4043
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x60
     Caps version1.2
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x68
PCI capability
     Caps classPCI Express
     Caps offset0x78
     Device typeLegacy PCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed2.5 GT/s (max 16.0 GT/s)
PCI capability
     Caps classVendor Dependant
     Caps offset0xB4
  
DescriptionHigh Definition Audio (HDA)
Locationbus 6 (0x06), device 0 (0x00), function 1 (0x01)
Common header
     Vendor ID0x10DE (NVIDIA)
     Model ID0x1AEF
     Revision ID0xA1
PCI header
     Address 0 (memory)0xFC0FC000
     Subvendor ID0x1458 (GIGABYTE)
     Subsystem ID0x4043
     Int. Line0x37
     Int. Pin0x02
PCI capability
     Caps classPower Management
     Caps offset0x60
     Caps version1.2
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x68
PCI capability
     Caps classPCI Express
     Caps offset0x78
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed2.5 GT/s (max 16.0 GT/s)
  
DescriptionNon-Essential Instrumentation Device
Locationbus 7 (0x07), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x148A
     Revision ID0x00
PCI header
     Subvendor ID0x1022 (AMD)
     Subsystem ID0x148A
     Int. Line0xFF
     Int. Pin0x00
PCI capability
     Caps classVendor Dependant
     Caps offset0x48
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x64
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed16.0 GT/s (max 16.0 GT/s)
  
DescriptionNon-Essential Instrumentation Device
Locationbus 8 (0x08), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1485
     Revision ID0x00
PCI header
     Subvendor ID0x1022 (AMD)
     Subsystem ID0x1485
     Int. Line0xFF
     Int. Pin0x00
PCI capability
     Caps classVendor Dependant
     Caps offset0x48
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x64
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed16.0 GT/s (max 16.0 GT/s)
  
DescriptionEncryption Device
Locationbus 8 (0x08), device 0 (0x00), function 1 (0x01)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1486
     Revision ID0x00
PCI header
     Address 2 (memory)0xFC300000
     Address 5 (memory)0xFC408000
     Subvendor ID0x1022 (AMD)
     Subsystem ID0x1486
     Int. Line0xFF
     Int. Pin0x01
PCI capability
     Caps classVendor Dependant
     Caps offset0x48
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x64
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed16.0 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
PCI capability
     Caps classMSI-X
     Caps offset0xC0
  
DescriptionUSB Controller (xHCI)
Locationbus 8 (0x08), device 0 (0x00), function 3 (0x03)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x149C
     Revision ID0x00
PCI header
     Address 0 (memory)0x00000000FC200004
     Subvendor ID0x1849 (Asrock)
     Subsystem ID0xFFFF
     Int. Line0x00
     Int. Pin0x03
PCI capability
     Caps classVendor Dependant
     Caps offset0x48
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x64
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed16.0 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
PCI capability
     Caps classMSI-X
     Caps offset0xC0
  
DescriptionHigh Definition Audio (HDA)
Locationbus 8 (0x08), device 0 (0x00), function 4 (0x04)
Common header
     Vendor ID0x1022 (AMD)
     Model ID0x1487
     Revision ID0x00
PCI header
     Address 0 (memory)0xFC4F8000
     Subvendor ID0x1849 (Asrock)
     Subsystem ID0x2224
     Int. Line0x24
     Int. Pin0x04
PCI capability
     Caps classVendor Dependant
     Caps offset0x48
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x64
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed16.0 GT/s (max 16.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
  
  
DMI 
SMBIOS Version3.3
  
DMI BIOS
     vendorAmerican Megatrends International LLC.
     versionP2.20
     date02/24/2022
     ROM size16384 KB
  
DMI System Information
     manufacturerTo Be Filled By O.E.M.
     productB550 Steel Legend
     versionTo Be Filled By O.E.M.
     serialTo Be Filled By O.E.M.
     UUID{03006B9C-DEAF-0000-0000-000000000000}
     SKUTo Be Filled By O.E.M.
     familyTo Be Filled By O.E.M.
  
DMI Baseboard
     vendorASRock
     modelB550 Steel Legend
     revisionunknown
     serialM80-FA017200107
  
DMI System Enclosure
     manufacturerTo Be Filled By O.E.M.
     chassis typeDesktop
     chassis serialTo Be Filled By O.E.M.
  
DMI Extension Slot
     designationJ6B2
     typePCI Express
     populatedyes
  
DMI Extension Slot
     designationJ6B1
     typePCI Express
     populatedyes
  
DMI Extension Slot
     designationJ6D1
     typePCI Express
     populatedyes
  
DMI Extension Slot
     designationJ7B1
     typePCI Express
     populatedyes
  
DMI Extension Slot
     designationJ8B4
     typePCI Express
     populatedyes
  
DMI Extension Slot
     designationJ8D1
     typePCI Express
     populatedyes
  
DMI OEM Strings
     string[0]To Be Filled By O.E.M.
  
DMI Additional Information Device
     string #1
     string[0]To Be Filled By O.E.M. 1
  
DMI Physical Memory Array
     locationMotherboard
     usageSystem Memory
     correctionNone
     max capacity128 GB
     max# of devices4
  
DMI Processor
     manufacturerAdvanced Micro Devices Inc.
     modelAMD Ryzen 9 5900X 12-Core Processor
     clock speed3700.0 MHz
     FSB speed100.0 MHz
     multiplier37.0x
     max clock speed4950.0 MHz
  
DMI Memory Device
     designationDIMM 0
     formatDIMM
     typeDDR4
     total width64 bits
     data width64 bits
     size8 GB
     speed2133 MHz
     manufacturerCorsair
     part numberCMH32GX4M4E3200C16
     serial number00000000
     voltage1.200000
     manufacturer id0x9E02
     product id0x0
  
DMI Memory Device
     designationDIMM 1
     formatDIMM
     typeDDR4
     total width64 bits
     data width64 bits
     size8 GB
     speed2133 MHz
     manufacturerCorsair
     part numberCMH32GX4M4E3200C16
     serial number00000000
     voltage1.200000
     manufacturer id0x9E02
     product id0x0
  
DMI Memory Device
     designationDIMM 0
     formatDIMM
     typeDDR4
     total width64 bits
     data width64 bits
     size8 GB
     speed2133 MHz
     manufacturerCorsair
     part numberCMH32GX4M4E3200C16
     serial number00000000
     voltage1.200000
     manufacturer id0x9E02
     product id0x0
  
DMI Memory Device
     designationDIMM 1
     formatDIMM
     typeDDR4
     total width64 bits
     data width64 bits
     size8 GB
     speed2133 MHz
     manufacturerCorsair
     part numberCMH32GX4M4E3200C16
     serial number00000000
     voltage1.200000
     manufacturer id0x9E02
     product id0x0
  
  
Graphics 
Number of adapters1
  
Graphic APIs 
APID3D
APINVIDIA I/O
APINVIDIA NVML
APINVIDIA NVAPI
     pwrMask0x001E7FFF
     pwrTable[F5 F6 F0 F7 FF FA FB E8 E9 EA F3 E3 F1 E2 EB 00 00 01 01 01 0B 00 00 00 00 00 00 00 00 00 00 00 ]
  
Display Adapters 
Display adapter 0 (primary)
     ID0x10B0102
     NameNVIDIA GeForce RTX 3090
     Board ManufacturerGIGABYTE Technology
     RevisionA1
     CodenameGA102-300
     Core family0x172 (GA102-A)
     Power Limit370.0 W (current), 370.0 W (default), 390.0 W (max)
     Thermal Limit93.0 �C (max), 95.0 �C (slowdown), 98.0 �C (shutdown)
     Cores10496
     ROP Units112
     TM Units656
     RayTracing Cores82
     Tensor Cores328
     Technology8 nm
     Memory typeGDDR6X
     Memory vendorMicron
     Memory size24 GB
     Memory bus width384 bits
     Current Link Widthx16
     Current Link Speed2.5 GT/s
     PCI devicebus 6 (0x6), device 0 (0x0), function 0 (0x0)
         Vendor ID0x10DE (0x1458)
         Model ID0x2204 (0x4043)
         Revision ID0xA1
     Root devicebus 0 (0x0), device 3 (0x3), function 1 (0x1)
     Performance LevelBase
         Core clock1395.0 MHz
         Memory clock9751.0 MHz
     Performance LevelBoost
         Core clock1755.0 MHz
         Memory clock9751.0 MHz
     Performance LevelCurrent
         Core clock210.0 MHz
         Memory clock405.0 MHz
     Driver version32.0.15.7283
     WDDM Model2.7
  
Win32_VideoControllerAdapterRAM = 0xFFF00000 (4293918720)
Win32_VideoControllerDriverVersion = 32.0.15.7283
Win32_VideoControllerDriverDate = 03/14/2025
  
Monitor 0
     Model27MX1 ()
     IDAOP06B3
     Serial
     Manufacturing DateWeek 14, Year 2020
     Size27.2 inches
     Max Resolution1920 x 1080 @ 74 Hz
     Horizontal Freq. Range30-85 kHz
     Vertical Freq. Range48-75 Hz
     Max Pixel Clock180 MHz
     Gamma Factor2.2
     Video Input0x80
  
Monitor 1
     Model27MX1 ()
     IDAOP06B3
     Serial
     Manufacturing DateWeek 51, Year 2019
     Size27.2 inches
     Max Resolution1920 x 1080 @ 74 Hz
     Horizontal Freq. Range30-85 kHz
     Vertical Freq. Range48-75 Hz
     Max Pixel Clock180 MHz
     Gamma Factor2.2
     Video Input0x80
  
  
Software 
Windows VersionMicrosoft Windows 10 Home (x64) Build 19045.5854
Windows Installation Date1/6/2023
DirectX Version12.0